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Semiconductor, microelectronics industry chip heat dissipation (thermal management) materials, nucle
Semiconductor, microelectronics industry chip heat dissipation (thermal management) materials, nucle
At present and in the future, the miniaturization and multi-functionalization of electronic components put forward higher requirements for the heat dissipation of the devices. High-performance heat dissipation (thermal management) materials need to have the characteristics of low density, high thermal conductivity, and thermal expansion matching with semiconductor chip materials, good hardness, and excellent air tightness. Tungsten-copper and molybdenum-copper are often preferred as heat sink materials due to the above advantages. We customizes a series of high-quality tungsten copper, molybdenum copper products for users.
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